| Capabilites |
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| KDS(SHENZHEN) TECHNOLOGY CO.,LTD |
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No.3002,Zhongshan Road & BYD Interchange , Pingshan District, Shen Zhen, China Tel:+86 13823514603 Fax:+86 (755)-89937238 E-mail: marketing@szkdspcb.com
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| Capabilites |
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Items |
Data |
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Max Layers |
FR2、FR4 ,FPC, FR408、 High-Tg、Halogen-Free、Cem-1、Cem-3、Arlon、 Gtek、Isola、Rogers、Neclo、ShengYi、Iteq、NanYa、Kingboard、Grace、GoWorld、BERGQUIST etc... |
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20 Layers |
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Max Board Size |
800mm x 600mm |
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Board Thickness |
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0.10mm~3.2mm |
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Min Board Thickness for Rigid Multi-layer Board |
4 layers: 0.38mm(15mils) |
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6 layers: 0.55mm(22mils) |
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8 layers: 0.80mm(32mils) |
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10 layers: 1.00mm(40mils) |
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Max Copper Thickness |
6OZ(External) / 6OZ(Inner) |
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Min Line Width/Space |
0.1mm |
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Min Hole Diameter |
0.10mm |
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Hole Position Deviation |
±0.05mm |
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PTH hole dia tolearance |
±0.076mm |
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NPTH hole dia tolearance |
±0.05mm |
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Impedance Control Tolerance |
±5%(≤50Ω) |
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±10%(＞50Ω) |
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Board Thickness Tolerance |
±10%(＞1.0mm) |
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±8%(<1.0mm) |
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Max Au Thickness of Immersion Gold |
3u'' |
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Max Au Thickness of Gold Finger |
50u'' |
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Min Bridge Width of Solder Mask Layer |
5mils |
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Bent and Twist |
≤0.075% |
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Aspect Ratio |
10:1 |
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Insulation Resistance |
＞1000 billionΩ Normal |
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Peel-off Strength |
1.4N/mm |
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Solder Mask Abrasion |
＞6H |
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Thermal Stress |
280 ℃ 10 Seconds |
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E-Test Voltage |
250V |
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V-cut |
25°/45°/60° |
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